US 12,332,825 B2
Apparatus and method for configuring a interconnect link between chiplets
Prakhar Srivastava, Lucknow (IN); Santhosh Reddy Akavaram, Hyderabad (IN); Aditya Singh Patel, Jabalpur (IN); and Ravi Kumar Sepuri, Hyderabad (IN)
Assigned to QUALCOMM Incorporated, San Diego, CA (US)
Filed by QUALCOMM Incorporated, San Diego, CA (US)
Filed on Sep. 8, 2023, as Appl. No. 18/463,852.
Prior Publication US 2025/0086132 A1, Mar. 13, 2025
Int. Cl. G06F 13/40 (2006.01)
CPC G06F 13/4068 (2013.01) 27 Claims
OG exemplary drawing
 
1. A method of configuring a die-to-die (D2D) interconnect link, comprising:
training the D2D interconnect link between a plurality of dies, the D2D interconnect link comprising a plurality of lanes grouped into a plurality of modules;
maintaining a training result of the D2D interconnect link based on the training of the D2D interconnect link, the training result comprising one or more available link configurations of the plurality of modules, at least one of the one or more available link configurations excluding a least significant byte module among the plurality of modules; and
selecting a link configuration of the one or more available link configurations to configure the D2D interconnect link including one or more of the plurality of modules.