US 12,332,718 B2
System on chip and semiconductor device including the same
Kyung-Min Park, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on May 12, 2023, as Appl. No. 18/316,697.
Claims priority of application No. 10-2022-0094002 (KR), filed on Jul. 28, 2022.
Prior Publication US 2024/0036627 A1, Feb. 1, 2024
Int. Cl. G06F 1/324 (2019.01); G06F 1/20 (2006.01); G06F 1/3206 (2019.01); G06F 1/3287 (2019.01); G06F 1/3296 (2019.01)
CPC G06F 1/324 (2013.01) [G06F 1/203 (2013.01); G06F 1/3206 (2013.01); G06F 1/3287 (2013.01); G06F 1/3296 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system on chip (SoC) comprising:
a plurality of functional blocks;
a frames per second (FPS) meter measuring FPS based on data processed by the functional blocks;
a thermal management unit (TMU) sensing a temperature of each of the functional blocks;
a dynamic voltage frequency scaling (DVFS) controller performing DVFS on the functional blocks; and
a power management unit (PMU) independently controlling a power of each of the functional blocks,
wherein the DVFS controller determines a reduction of the FPS for the functional blocks and a reduction of the temperature of the SoC corresponding to when an operating frequency of at least one of the functional blocks is limited, and limits the operating frequency of the at least one of the functional blocks to a threshold value or less based on the determination.