US 12,332,717 B2
Server farm with at least one hybrid computing module operating at clock speed optimally matching intrinsic clock speed of a related semiconductor die related thereto
L. Pierre de Rochemont, Austin, TX (US)
Filed by L. Pierre de Rochemont, Austin, TX (US)
Filed on Jun. 15, 2023, as Appl. No. 18/210,601.
Application 18/210,601 is a division of application No. 16/403,411, filed on May 3, 2019, granted, now 11,681,348.
Claims priority of provisional application 62/666,124, filed on May 3, 2018.
Prior Publication US 2023/0367384 A1, Nov. 16, 2023
Int. Cl. G06F 1/324 (2019.01); G05B 9/02 (2006.01)
CPC G06F 1/324 (2013.01) [G05B 9/02 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A server farm comprising:
a plurality of servers, a power management system that delivers electrical power to the server farm and requires three or fewer high efficiency stages between a power and/or primary power source and any intrinsic AC or DC power bus in the server farm that consumes electric power,
each one of the plurality of servers comprising:
a semiconductor die embedded in a high-speed semiconductor chip stack or a semiconductor carrier,
at least one hybrid computing module operating at a system clock speed that optimally matches an intrinsic clock speed of the semiconductor die embedded within the high-speed semiconductor chip stack or mounted upon the semiconductor carrier; and
one or more high-speed semiconductor chip stacks bonded to a surface of semiconductor carrier in which at least one passive component element maintains critical performance tolerances and has a polarization response time determined solely by orbital deformations and operates in phase, thus does not distort, any of an applied signal components forming a high-speed digital pulse operating at clock speeds that run into a terahertz (THz) frequency domain;
wherein the servers of the server farm are mounted within a plurality of slots in a server rack, further comprising a first harness that forms a communications bus interface, preferably an optical interface, with other servers mounted within the server rack; and
wherein the server racks are assembled to form a server tower comprising a plurality of server racks and a second harness that forms a communications bus interface, preferably an optical interface, with other servers mounted within the server tower.