| CPC G03F 7/0752 (2013.01) [C07F 7/1804 (2013.01); C08G 77/14 (2013.01); C08G 77/18 (2013.01); C08G 77/24 (2013.01); G03F 7/0751 (2013.01); G03F 7/0757 (2013.01); G03F 7/091 (2013.01); G03F 7/11 (2013.01); G03F 7/36 (2013.01)] | 12 Claims |

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1. A composition for forming a silicon-containing resist underlayer film for EUV lithography, comprising:
a thermosetting silicon-containing material; and
a crosslinking catalyst, wherein
the thermosetting silicon-containing material comprises:
(i) one or more of
a repeating unit shown by the following general formula (Sx-1),
a repeating unit shown by the following general formula (Sx-2), and
a partial structure shown by the following general formula (Sx-3),
![]() wherein R1 represents an iodine-containing organic group shown by the following general formula (Sx-R1):
![]() wherein R11 represents a single bond; R12 represents a monovalent organic group having 1 to 10 carbon atoms, a hydroxyl group, or a halogen atom other than iodine; n1 is 1, 2, or 3; and n2 is 0, 1, or 2; and R2 and R3 are each independently identical to R1, a hydrogen atom, or a monovalent organic group having 1 to 30 carbon atoms, and
(ii) one or more of partial structures shown by the following formulae (Sx-x),
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