US 12,332,562 B2
Molding apparatus for molding composition on substrate using mold, molding method, and method for manufacturing article
Takanori Endo, Utsunomiya (JP)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Nov. 16, 2022, as Appl. No. 18/056,191.
Application 18/056,191 is a continuation of application No. 16/297,455, filed on Mar. 8, 2019, granted, now 11,526,074.
Claims priority of application No. 2018-044356 (JP), filed on Mar. 12, 2018.
Prior Publication US 2023/0073885 A1, Mar. 9, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G03F 7/00 (2006.01)
CPC G03F 7/0002 (2013.01) 14 Claims
OG exemplary drawing
 
1. An apparatus for curing a composition on a substrate in contact with a mold including a recessed portion and a protruding portion or a template including a planar portion, the apparatus comprising:
a conveying unit configured to convey the mold or the template, wherein the conveying unit is provided with a hand portion configured to hold the mold or the template, and an arm portion attached with the hand portion;
a holding unit configured to hold the mold or the template conveyed by the conveying unit;
a supply unit configured to supply gas to a space surrounding the mold or the template held by the holding unit; and
a control unit configured to control the supply unit so that a first amount of supply per unit time of the gas to be supplied from the supply unit in a case where at least one of the hand portion and the arm portion is inside the space, to be smaller than a second amount of supply per unit time of the gas to be supplied from the supply unit in a case where the hand portion and the arm portion are outside the space.