US 12,332,514 B2
Display device, splicing display device
Dan Li, Beijing (CN); Zhaoshou Tian, Beijing (CN); Qingshan Qu, Beijing (CN); Haijun Shi, Beijing (CN); Hongbo Feng, Beijing (CN); Bochang Wang, Beijing (CN); Changjia Fu, Beijing (CN); and Zhuang Xu, Beijing (CN)
Assigned to Beijing BOE Display Technology Co., Ltd., Beijing (CN); and BOE Technology Group Co., Ltd., Beijing (CN)
Appl. No. 18/280,957
Filed by Beijing BOE Display Technology Co., Ltd., Beijing (CN); and BOE Technology Group Co., Ltd., Beijing (CN)
PCT Filed Feb. 22, 2023, PCT No. PCT/CN2023/077706
§ 371(c)(1), (2) Date Sep. 8, 2023,
PCT Pub. No. WO2023/207287, PCT Pub. Date Nov. 2, 2023.
Claims priority of application No. 202210439659.1 (CN), filed on Apr. 25, 2022.
Prior Publication US 2025/0028197 A1, Jan. 23, 2025
Int. Cl. G02F 1/1333 (2006.01); G02F 1/1335 (2006.01); G02F 1/13357 (2006.01)
CPC G02F 1/13336 (2013.01) [G02F 1/133512 (2013.01); G02F 1/133528 (2013.01); G02F 1/133605 (2013.01); G02F 1/133606 (2013.01); G02F 1/133608 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A display device, comprising:
a display panel, comprising a display region and a non-display region surrounding the display region, the non-display region comprising a bonding region;
a backlight module disposed opposite to the display panel;
a tape layer located on a peripheral side of the display panel and the backlight module, wherein an orthographic projection of the tape layer on a plane where the display device is located is not overlapped with an orthographic projection of the display panel on the plane where the display device is located,
wherein the display device further comprises a circuit board and a chip on film, wherein the circuit board and the chip on film are located on an outer side of the backlight module, one end of the chip on film is connected to the bonding region and covers a partial region of a side surface of the bonding region, and the other end of the chip on film is connected to the circuit board.