| CPC G02B 6/1225 (2013.01) [G02B 6/12004 (2013.01); G02B 6/12007 (2013.01); G02B 6/13 (2013.01); G02B 6/136 (2013.01); H01L 21/0275 (2013.01); H04J 14/02 (2013.01)] | 20 Claims |

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1. A photonic communication platform comprising:
a semiconductor photonic substrate comprising an optical network having a plurality of optical waveguides and a plurality of optical transceivers coupled to respective optical waveguides, wherein the plurality of optical waveguides and the plurality of optical transceivers are lithographically patterned on the semiconductor photonic substrate;
a plurality of electrical connections configured to electrically couple the optical network to a plurality of electronic chips when the electronic chips are mounted on the semiconductor photonic substrate, wherein at least one electronic chip of the plurality of electronic chips comprises a memory; and
a controller configured to control the optical network to broadcast a message generated by a first electronic chip of the plurality of electronic chips to more than one of the remaining electronic chips of the plurality of electronic chips, when the plurality of electronic chips are mounted on the semiconductor photonic substrate.
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