US 12,332,477 B2
Methods and apparatus to reduce stress on lasers in optical transceivers
Aditi Mallik, Cupertino, CA (US); Pengyue Wen, San Jose, CA (US); Quan Tran, Fremont, CA (US); Wendai Wang, Dublin, CA (US); and Xiaozhong Wang, Cupertino, CA (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Sep. 14, 2021, as Appl. No. 17/474,938.
Prior Publication US 2023/0083610 A1, Mar. 16, 2023
Int. Cl. G02B 6/12 (2006.01); H04B 10/40 (2013.01)
CPC G02B 6/12 (2013.01) [H04B 10/40 (2013.01)] 25 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a printed circuit board (PCB) having a first side and a second side opposite the first side;
a first stiffener attached to the first side of the PCB;
a photonic integrated circuit (PIC) attached to the first stiffener, the first stiffener between the PIC and the PCB; and
a second stiffener attached to the second side of the PCB.