US 12,332,380 B2
Chip packaging in light detection and ranging (LIDAR) sensor system
Colin Delaney, Bozeman, MT (US); James Ferrara, Oakland, CA (US); Stefan Heinemann, Bozeman, MT (US); Amir Hosseini, San Jose, CA (US); Pruthvi Jujjavarapu, Palo Alto, CA (US); Yongxuan Liang, Fremont, CA (US); Parth Panchal, Englewood, CO (US); and Zhizhong Tang, Palo Alto, CA (US)
Assigned to Aurora Operations, Inc., Pittsburgh, PA (US)
Filed by Aurora Operations, Inc., Pittsburgh, PA (US)
Filed on Nov. 22, 2023, as Appl. No. 18/517,431.
Application 18/517,431 is a continuation of application No. 18/056,171, filed on Nov. 16, 2022, granted, now 11,860,308.
Prior Publication US 2024/0159874 A1, May 16, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. G01S 7/481 (2006.01); G01S 17/931 (2020.01); H05K 7/20 (2006.01)
CPC G01S 7/4814 (2013.01) [G01S 7/4816 (2013.01); G01S 7/4817 (2013.01); G01S 17/931 (2020.01); H05K 7/20509 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated chip packaging of a LIDAR sensor system of a vehicle, the integrated chip packaging comprising:
a first device including a laser source configured to generate a beam; and
a second device including a transceiver coupled to the first device, wherein an edge of the second device is coupled to the first device for receiving the beam and the second device is configured to:
emit the beam at a right angle from a first surface of the second device through an optical window of the integrated chip packaging; and
receive a reflected beam from a target through the optical window.