CPC G01S 7/4814 (2013.01) [G01S 7/4816 (2013.01); G01S 7/4817 (2013.01); G01S 17/931 (2020.01); H05K 7/20509 (2013.01)] | 20 Claims |
1. An integrated chip packaging of a LIDAR sensor system of a vehicle, the integrated chip packaging comprising:
a first device including a laser source configured to generate a beam; and
a second device including a transceiver coupled to the first device, wherein an edge of the second device is coupled to the first device for receiving the beam and the second device is configured to:
emit the beam at a right angle from a first surface of the second device through an optical window of the integrated chip packaging; and
receive a reflected beam from a target through the optical window.
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