US 12,332,277 B1
Thermal management system for a test-and-measurement probe
Matthew J. Hull, Beaverton, OR (US); Julie A. Campbell, Beaverton, OR (US); and David Thomas Engquist, Portland, OR (US)
Assigned to Tektronix, Inc., Beaverton, OR (US)
Filed by Tektronix, Inc., Beaverton, OR (US)
Filed on Jan. 23, 2023, as Appl. No. 18/100,535.
Application 18/100,535 is a continuation in part of application No. 17/096,622, filed on Nov. 12, 2020, granted, now 11,578,925, issued on Feb. 14, 2023.
Claims priority of provisional application 62/936,371, filed on Nov. 15, 2019.
This patent is subject to a terminal disclaimer.
Int. Cl. G01R 1/067 (2006.01); F28C 3/04 (2006.01); G01K 1/02 (2021.01); G01K 1/14 (2021.01)
CPC G01R 1/06783 (2013.01) [F28C 3/04 (2013.01); G01K 1/026 (2013.01); G01K 1/14 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A thermal management system for a test-and-measurement probe, the thermal management system comprising:
a thermally insulated shroud configured to enclose a first portion of a test-and-measurement probe within an interior cavity of the shroud, while permitting a second portion of the test-and-measurement probe to extend out of the shroud into a testing environment; and
a fluid inlet conduit entering the shroud through an access portion of the shroud, extending through the interior cavity of the shroud, and configured to introduce a heat-transfer fluid to a probe-head portion of the test-and-measurement probe.