US 12,332,130 B2
Force sensor module
Yoshikane Tanaami, Nagoya (JP); Miyuki Hayashi, Nagoya (JP); Yoshiaki Kanamori, Sendai (JP); and Taiyu Okatani, Sendai (JP)
Assigned to SINTOKOGIO, LTD., Aichi (JP)
Filed by SINTOKOGIO, LTD., Nagoya (JP); and TOHOKU UNIVERSITY, Sendai (JP)
Filed on Mar. 7, 2023, as Appl. No. 18/179,608.
Claims priority of application No. 2022-059543 (JP), filed on Mar. 31, 2022.
Prior Publication US 2023/0314247 A1, Oct. 5, 2023
Int. Cl. G01L 1/24 (2006.01)
CPC G01L 1/24 (2013.01) 4 Claims
OG exemplary drawing
 
1. A force sensor module comprising:
a first substrate having light transparency;
a metasurface pattern provided on a first principal surface of the first substrate;
a second substrate provided so as to face the first substrate and including a second principal surface that faces the first principal surface;
a reflective layer provided on the second principal surface;
a spacer layer provided on the first principal surface and made of an electrically-conductive material;
a joining layer for joining the second principal surface and the spacer layer together; and
a grounding wire connected to the spacer layer.