US 12,332,001 B1
Method of manufacturing heat dissipation module
Chun-Yi Chiang, Taoyuan (TW); Yi-Sheng Chiu, Taoyuan (TW); and Chiao Hsiang Chang, Taoyuan (TW)
Assigned to Jentech Precision Industrial Co., LTD., Taoyuan (TW)
Filed by Jentech Precision Industrial Co., LTD., Taoyuan (TW)
Filed on Jun. 13, 2024, as Appl. No. 18/741,828.
Claims priority of application No. 113117079 (TW), filed on May 8, 2024.
Int. Cl. F28F 13/18 (2006.01); B23P 15/26 (2006.01); F28D 21/00 (2006.01)
CPC F28F 13/18 (2013.01) [B23P 15/26 (2013.01); F28D 2021/0028 (2013.01); F28F 2245/00 (2013.01); F28F 2255/08 (2013.01); F28F 2275/06 (2013.01); Y10T 29/4935 (2015.01)] 21 Claims
OG exemplary drawing
 
1. A method of manufacturing a heat dissipation module, the method comprising:
providing a main body;
disposing a thermal interface material (TIM) layer on the main body;
applying a first pressure to a surface of the TIM layer away from the main body in stages regionally;
applying a second pressure to an entire portion of the surface at a same time after the first pressure is applied; and
abutting the surface against a chip after the second pressure is applied.