CPC F28D 15/0233 (2013.01) [F28D 15/046 (2013.01)] | 24 Claims |
1. A vapor chamber, configured to accommodate a cooling fluid, and the vapor chamber comprising:
a first cover, having a contact surface, wherein the contact surface is configured to be in thermal contact with a heat source, and;
a second cover, wherein the second cover and the first cover are attached to each other to form a chamber therebetween, and the chamber is configured to accommodate the cooling fluid;
a first capillary structure, wherein the first capillary structure is located in the chamber and stacked on the first cover;
a second capillary structure, wherein the second capillary structure is located in the chamber and stacked on the first capillary structure, the second capillary structure is different from the first capillary structure, and an entire projection of the second capillary structure onto the first cover is completely overlapped with a projection of the first capillary structure onto the first cover;
a plurality of supporting posts, wherein each of the plurality of supporting posts is in direct contact with the first cover and the second cover at two opposite sides thereof; and
only one irregularly-shaped hollow part, formed through the first cover and the second cover and surrounded by the first capillary structure, wherein the contact surface is located between the irregularly-shaped hollow part and the second capillary structure.
|