US 12,331,913 B2
Method for manufacturing electronic constructive object and electronic constructive object thereof
Chih-Hung Lin, Nanjing County (CN); Kun-Chuan Chang, Nanjing County (CN); Keng-Yu Tsao, Nanjing County (CN); and Yu-Hsuan Sung, Nanjing County (CN)
Assigned to PIN SHINE ELECTRONIC (ZHANGHOU) CO., LTD., Nanjing (CN)
Filed by Chih-Hung Lin, Nanjing County (CN); Kun-Chuan Chang, Nanjing County (CN); Keng-Yu Tsao, Nanjing County (CN); and Yu-Hsuan Sung, Nanjing County (CN)
Filed on Dec. 29, 2022, as Appl. No. 18/091,364.
Prior Publication US 2024/0219012 A1, Jul. 4, 2024
Int. Cl. F21V 23/04 (2006.01); A63H 33/04 (2006.01)
CPC F21V 23/0414 (2013.01) [A63H 33/042 (2013.01); Y10T 29/49117 (2015.01)] 8 Claims
OG exemplary drawing
 
1. A method for manufacturing an electronic constructive object, comprising:
a) producing an insulative three-dimensional member having a room and an opening communicating with the room;
b) forming a connecting mechanism on an outer surface of the three-dimensional member;
c) planning a predetermined circuit pattern on an inner surface of the room through the opening;
d) planning a contact portion on an outer surface of the three-dimensional member for external electric connection;
e) scanning an area in which both the circuit pattern and the contact portion are located by laser;
f) forming a through hole between the circuit pattern and the contact portion with the laser to make both the circuit pattern and the contact portion uninsulated, and forming a roughened surface on the area scanned by heat of the laser;
g) depositing a layer of conductive material on the roughened surface by a mixture of a catalyst solution and metal powder, wherein a region on which the layer of conductive material is deposited comprises the circuit pattern, the contact portion and an inner wall of the through hole; and
h) immersing the three-dimensional member in a reaction tank to implement electroless plating to gradually thicken the layer of conductive material to become a conductor, wherein the conductor penetrating the through hole makes the circuit pattern and the contact portion electrically connected.