US 12,331,420 B2
Plating apparatus and plating method
Masashi Shimoyama, Tokyo (JP); Yasuyuki Masuda, Tokyo (JP); and Ryosuke Hiwatashi, Tokyo (JP)
Assigned to EBARA CORPORATION, Tokyo (JP)
Appl. No. 17/923,163
Filed by EBARA CORPORATION, Tokyo (JP)
PCT Filed Jan. 31, 2022, PCT No. PCT/JP2022/003526
§ 371(c)(1), (2) Date Nov. 3, 2022,
PCT Pub. No. WO2023/145049, PCT Pub. Date Aug. 3, 2023.
Prior Publication US 2024/0247394 A1, Jul. 25, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. C25D 17/00 (2006.01); C25D 7/12 (2006.01)
CPC C25D 17/008 (2013.01) [C25D 7/12 (2013.01); C25D 17/001 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A plating apparatus comprising:
a plating tank for housing a plating solution;
an anode disposed in the plating tank;
a substrate holder for holding a substrate with a surface to be plated facing downward;
a rotation mechanism configured to rotate the substrate holder in a first direction and a second direction opposite to the first direction; and
a shielding mechanism configured to move a shielding member into between the anode and the substrate depending on a rotation angle of the substrate holder, wherein the shielding mechanism is configured to move the shielding member into between the anode and a specific portion of the substrate when a rotation angle of the specific portion of the substrate held by the substrate holder is within a predetermined range, and
the rotation mechanism is configured to switch a rotation direction of the substrate holder between the first direction and the second direction when the rotation angle of the specific portion of the substrate is within a predetermined range.