US 12,331,390 B2
Argon-helium based coating
Andrew Clark, Santa Rosa, CA (US); and Georg J. Ockenfuss, Santa Rosa, CA (US)
Assigned to VIA VI SOLUTIONS INC., Chandler, AZ (US)
Filed by VIAVI Solutions Inc., San Jose, CA (US)
Filed on Sep. 10, 2021, as Appl. No. 17/447,308.
Application 17/447,308 is a continuation of application No. 16/103,632, filed on Aug. 14, 2018, granted, now 11,131,018.
Prior Publication US 2021/0404053 A1, Dec. 30, 2021
Int. Cl. C23C 14/35 (2006.01); C23C 14/00 (2006.01); C23C 14/10 (2006.01); C23C 14/14 (2006.01); C23C 14/34 (2006.01); C23C 14/56 (2006.01)
CPC C23C 14/35 (2013.01) [C23C 14/0057 (2013.01); C23C 14/10 (2013.01); C23C 14/14 (2013.01); C23C 14/34 (2013.01); C23C 14/3407 (2013.01); C23C 14/56 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A sputtering system, comprising:
a substrate;
a first target on a first cathode,
wherein the first target comprises a first coating material source;
a second target on a second cathode, and
wherein the second target comprises a second coating material source;
a cathode power supply configured to power the first cathode and the second cathode; and
a vacuum chamber configured to be filled with a mixture of argon gas and helium gas when a first coating is deposited onto a first side of the substrate and to be filled with argon gas, without helium gas, when a second coating is deposited onto a second side of the substrate,
wherein the first coating has a first thickness,
wherein the second side of the substrate is different from the first side of the substrate,
wherein the first coating includes one or more first materials that are different from one or more second materials of the second coating,
wherein the second coating has a second thickness that is greater than the first thickness, and
wherein, in the mixture of argon gas and helium gas, a flow rate for argon gas is configured to be between 200 standard cubic centimeters per minute (SCCM) and 500 SCCM and a helium gas contribution is configured to be between 9% and 60%.