US 12,331,386 B2
Pure copper plate
Hirotaka Matsunaga, Aizuwakamatsu (JP); Yuki Ito, Ageo (JP); Hiroyuki Mori, Tsukuba (JP); Norihisa Iida, Sakai (JP); and Motohiro Hitaka, Sakai (JP)
Assigned to MITSUBISHI MATERIALS CORPORATION, Tokyo (JP)
Appl. No. 17/909,707
Filed by MITSUBISHI MATERIALS CORPORATION, Tokyo (JP)
PCT Filed Mar. 8, 2021, PCT No. PCT/JP2021/008945
§ 371(c)(1), (2) Date Sep. 6, 2022,
PCT Pub. No. WO2021/177469, PCT Pub. Date Sep. 10, 2021.
Claims priority of application No. 2020-038770 (JP), filed on Mar. 6, 2020.
Prior Publication US 2023/0112081 A1, Apr. 13, 2023
Int. Cl. C22F 1/08 (2006.01); C22C 9/00 (2006.01)
CPC C22F 1/08 (2013.01) [C22C 9/00 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A pure copper sheet having a composition comprising:
99.96 mass % or more of Cu;
0.01 mass ppm or more and 3.00 mass ppm or less of P;
3.0 mass ppm or more of a total content of Ag and Fe; and
inevitable impurities as a balance, wherein
an average crystal grain size of crystal grains on a rolled surface is 10 μm or more,
a Kernel average misorientation (KAM) value is 1.50 or less when a measurement area of 1 mm2 or more is measured by an EBSD method at measurement intervals of 5 μm steps, a measurement point where a CI value analyzed with data analysis software OIM is 0.1 or less is excluded, and a boundary where an orientation angle between adjacent pixels is 5° or more is regarded as a crystal grain boundary, and
a thickness of the pure copper sheet is in a range of 0.5 mm or more and 5 mm or less.