| CPC C09J 9/02 (2013.01) [C08G 59/1466 (2013.01); C08G 59/1494 (2013.01); C08K 9/06 (2013.01); C09J 11/04 (2013.01); C09J 163/10 (2013.01); C08K 2201/001 (2013.01)] | 15 Claims |
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1. A photo-thermal dual-curing conductive adhesive, having the following raw material composition by weight:
5% to 16% epoxy resin;
6% to 15% modified epoxy acrylate prepolymer;
2% to 6% a crosslinker;
2% to 5% a diluent;
1% to 3% a toughening agent;
70% to 85% surface modified silver powder;
0.3% to 1% a photoinitiator;
0.5% to 1.8% a latent curing agent;
0.4% to 1.2% a curing accelerator; and
1% to 3% an additive,
wherein the surface modified silver powder is obtained by surface modification of silver powder with a silane coupling agent, and the silane coupling agent is at least one of a vinyl silane coupling agent and an epoxy silane coupling agent,
wherein the modified epoxy acrylate prepolymer, prepared from in parts by weight 45 to 72 parts of epoxy resin, 12 to 20 parts of 1,4-butanediol diglycidyl ether, 7 parts to 26 parts of organic dibasic acid, 5 to 15 parts of acrylic acid, and 0.26 to 0.45 parts of polymerization inhibitor under the catalysis of 0.13 to 0.28 parts of catalyst,
wherein a general structural formula of the organic dibasic acid is HOOC—R—COOH; in the formula, R is saturated aliphatic hydrocarbonyl, unsaturated aliphatic hydrocarbonyl or aromatic hydrocarbonyl, and the organic dibasic acid has a molecular weight of 90 to 300; and the modified epoxy acrylate prepolymer has an epoxy group content of 3% to 9%, a hydroxyl content of 3% to 10% and a vinyl content of 2% to 8%.
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