	US 12,331,212 B2
	Resin composition, copper foil with resin, and printed wiring board
Kazuhiro Oosawa, Ageo (JP); Ayumu Tateoka, Nantou (TW); Kuniharu Ogawa, Ageo (JP); and Haruka Makino, Ageo (JP)
Assigned to MITSUI MINING & SMELTING CO., LTD., Tokyo (JP)
Appl. No. 18/276,546
Filed by MITSUI MINING & SMELTING CO., LTD., Tokyo (JP)
PCT Filed Jan. 26, 2022, PCT No. PCT/JP2022/002966 § 371(c)(1), (2) Date Aug. 9, 2023, PCT Pub. No. WO2022/172759, PCT Pub. Date Aug. 18, 2022.
Claims priority of application No. 2021-019760 (JP), filed on Feb. 10, 2021.
Prior Publication US 2024/0101858 A1, Mar. 28, 2024
Int. Cl. C09D 153/02 (2006.01); C08F 297/04 (2006.01); C08K 5/06 (2006.01); C09D 125/12 (2006.01); H05K 1/05 (2006.01)

CPC C09D 153/025 (2013.01) [C08F 297/046 (2013.01); C08K 5/06 (2013.01); C09D 125/12 (2013.01); H05K 1/056 (2013.01); C08F 2810/20 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/0358 (2013.01)]

7 Claims

1. A resin composition comprising:

an arylene ether compound having a weight average molecular weight of 30000 or higher; and

a styrenic copolymer having, in its molecule, a reactive unsaturated bond that exhibits reactivity by heat or an ultraviolet ray, wherein the reactive unsaturated bond is at least one selected from the group consisting of a cyanate group, a maleimide group, a vinyl group, a (meth)acryloyl group, an ethynyl group, and a styryl group;

wherein a content of the arylene ether compound is 25 parts by weight or more and 60 parts by weight or less based on 100 parts by weight of the total amount in terms of solid content of resin components of the resin composition; and

wherein a content of the styrenic copolymer is 10 parts by weight or more and 43 parts by weight or less, based on 100 parts by weight of the total amount in terms of solid content of resin components of the resin composition.