US 12,331,182 B2
Resin composition and resin-attached copper foil
Kazuhiro Oosawa, Ageo (JP); Haruka Makino, Ageo (JP); and Kuniharu Ogawa, Ageo (JP)
Assigned to MITSUI MINING & SMELTING CO., LTD., Tokyo (JP)
Appl. No. 17/442,330
Filed by MITSUI MINING & SMELTING CO., LTD., Tokyo (JP)
PCT Filed Mar. 5, 2020, PCT No. PCT/JP2020/009319
§ 371(c)(1), (2) Date Sep. 23, 2021,
PCT Pub. No. WO2020/195661, PCT Pub. Date Oct. 1, 2020.
Claims priority of application No. 2019-063436 (JP), filed on Mar. 28, 2019.
Prior Publication US 2022/0169842 A1, Jun. 2, 2022
Int. Cl. C08L 23/0869 (2025.01); B05D 7/26 (2006.01); B32B 17/10 (2006.01); C08L 33/06 (2006.01)
CPC C08L 23/0869 (2013.01) [B05D 7/26 (2013.01); B32B 17/10 (2013.01); C08L 33/064 (2013.01); B05D 2202/45 (2013.01); B05D 2203/35 (2013.01); C08L 2201/10 (2013.01); C08L 2205/035 (2013.01); C08L 2312/06 (2013.01)] 7 Claims
 
1. A resin composition comprising the following components:
(a) an acrylic polymer having a tensile modulus of 200 MPa or less as measured in accordance with JIS K7161-1:2014;
(b) a resin that is solid at 25° C.;
(c) a resin that is liquid at 25° C. and crosslinkable with at least one of the component (a) and the component (b); and
(d) a polymerization initiator,
wherein the resin composition contains
the component (a) in an amount of 35 parts by weight or more and 93 parts by weight or less,
the component (b) in an amount of 3 parts by weight or more and 60 parts by weight or less, and
the component (c) in an amount of 1 part by weight or more and 25 parts by weight or less,
based on 100 parts by weight of a total amount of the component (a), the component (b), and the component (c);
wherein a weight ratio of the component (c) to the component (d) is 700 or more and 5000 or less; and
wherein the resin composition has transparency after curing.