US 12,330,981 B2
Polyimide precursor resin composition for forming flexible device substrate
Norio Miura, Ube (JP); Kazutaka Narita, Ube (JP); and Takeshige Nakayama, Ube (JP)
Assigned to UBE Corporation, Ube (JP)
Appl. No. 16/957,326
Filed by UBE Corporation, Ube (JP)
PCT Filed Dec. 27, 2018, PCT No. PCT/JP2018/048158
§ 371(c)(1), (2) Date Sep. 14, 2020,
PCT Pub. No. WO2019/131884, PCT Pub. Date Jul. 4, 2019.
Claims priority of application No. 2017-254339 (JP), filed on Dec. 28, 2017.
Prior Publication US 2020/0407593 A1, Dec. 31, 2020
Int. Cl. C03C 17/32 (2006.01); B05D 1/00 (2006.01); B05D 3/02 (2006.01); B32B 9/00 (2006.01); B32B 17/10 (2006.01); C03C 17/42 (2006.01); C08G 73/10 (2006.01); C08G 73/12 (2006.01); C08J 5/18 (2006.01); C09D 179/08 (2006.01); C23C 16/40 (2006.01); G02F 1/1333 (2006.01); G02F 1/1368 (2006.01); G09F 9/30 (2006.01); H10D 30/67 (2025.01); H10D 86/40 (2025.01); H10D 86/60 (2025.01)
CPC C03C 17/32 (2013.01) [B32B 17/10 (2013.01); C03C 17/42 (2013.01); C08G 73/1028 (2013.01); C08G 73/1067 (2013.01); C08G 73/1071 (2013.01); C08G 73/121 (2013.01); C08G 73/128 (2013.01); C09D 179/08 (2013.01); C09D 179/085 (2013.01); C23C 16/401 (2013.01); G02F 1/133305 (2013.01); H10D 30/6746 (2025.01); H10D 86/411 (2025.01); H10D 86/421 (2025.01); H10D 86/60 (2025.01); C03C 2218/116 (2013.01); C03C 2218/152 (2013.01); G02F 1/1368 (2013.01)] 8 Claims
 
1. A method for producing a flexible device substrate, comprising steps of:
(A) forming a laminate including a carrier substrate and a polyimide film formed thereon, wherein the laminate is formed by casting a polyimide precursor resin composition comprising a polyamic acid on the carrier substrate, and imidizing the polyamic acid by heat treatment to form a polyimide film, wherein
the polyamic acid has a structure obtained from a tetracarboxylic acid component comprising at least one of 3,3′,4,4′-biphenyltetracarboxylic dianhydride and pyromellitic dianhydride; a diamine component comprising at least one of paraphenylenediamine and 4,4′-diaminodiphenyl ether; and a carboxylic acid monoanhydride; wherein the polyamic acid satisfies following equations (1) and (2):
0.97≤X/Y<1.00  Equation (1)
0.5≤(Z/2)/(Y−X)≤1.05  Equation (2)
wherein X represents a number of moles of tetracarboxylic acid component, Y represents a number of moles of diamine component, and Z represents a number of moles of the carboxylic acid monoanhydride, wherein a peel strength between the carrier substance and the polyimide film is 300 mN/mm or more;
(B) forming an inorganic film on the polyimide film; and
(C) separating the polyimide film from the carrier substrate to form a flexible device substrate including the polyimide film,
wherein the steps are performed in an order of (A), (B), and (C).