US 12,330,977 B2
Thin glass plate processing apparatus and method
Chang Seock Lee, Cheonan-si (KR); and Kyoung Ho Choi, Goyang-si (KR)
Assigned to HANA TECHNOLOGY CO., LTD., Yongin-si (KR)
Filed by HANA TECHNOLOGY CO., LTD., Yongin-si (KR)
Filed on May 17, 2023, as Appl. No. 18/319,102.
Claims priority of application No. 10-2023-0036511 (KR), filed on Mar. 21, 2023.
Prior Publication US 2024/0317626 A1, Sep. 26, 2024
Int. Cl. C03B 23/02 (2006.01); B24B 9/10 (2006.01); B24B 49/12 (2006.01)
CPC C03B 23/02 (2013.01) [B24B 9/10 (2013.01); B24B 49/12 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A thin glass plate processing apparatus comprising:
a heating part configured to heat-chamfer side wall portions and/or corner portions of a glass plate on a jig as at least a side thereof is heated;
a uniform pressure control part configured to move the heating part adjacent to the glass plate along a processing orthogonal direction so that the heating part heat-chamfers the side wall portions and/or the corner portions of the glass plate while pressing the side wall portions and/or the corner portions with a substantially uniform pressure, the uniform pressure control part including a voice coil motor (VCM);
an imaging part configured to photograph a side of a processing member, the imaging part including a vision camera;
a first correction part configured to align the processing member along a processing direction, the first correction part including a first moving plate member and a first elastic member disposed along the processing direction; and
a second correction part configured to align the processing member along the processing orthogonal direction, the second correction part including a second moving plate member and a second elastic member disposed along the processing orthogonal direction,
wherein the heating part comprises:
a body portion configured to fix the processing member to a lower side thereof, the body portion having a first rod-shaped body; and
the processing member configured to heat-chamfer the glass plate in contact with the side wall portions and/or the corner portions of the adjacent glass plate by being heated by a high-frequency induction heater, the processing member having a second rod-shaped body, and
wherein only a single processing point of the processing member is configured to be brought into contact with the side wall portions and/or the corner portions of the glass plate.