US 12,330,849 B2
Liquid repellent layer-forming resin composition, and liquid repellent film, liquid repellent laminate, packaging material, and container using same
Aki Nagai, Tokyo (JP); Ryo Tanaka, Tokyo (JP); Kentaro Kimura, Tokyo (JP); Kosuke Kinoshita, Tokyo (JP); and Hitomi Fukutake, Tokyo (JP)
Assigned to TOPPAN PRINTING CO., LTD., Tokyo (JP)
Appl. No. 17/277,218
Filed by TOPPAN PRINTING CO., LTD., Tokyo (JP)
PCT Filed Sep. 17, 2019, PCT No. PCT/JP2019/036405
§ 371(c)(1), (2) Date Mar. 17, 2021,
PCT Pub. No. WO2020/059717, PCT Pub. Date Mar. 26, 2020.
Claims priority of application No. 2018-177516 (JP), filed on Sep. 21, 2018; application No. 2018-177518 (JP), filed on Sep. 21, 2018; and application No. 2019-039438 (JP), filed on Mar. 5, 2019.
Prior Publication US 2021/0309428 A1, Oct. 7, 2021
Int. Cl. B65D 65/40 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/18 (2006.01); B32B 27/28 (2006.01); B32B 27/32 (2006.01); C08L 23/26 (2025.01); C08L 53/00 (2006.01)
CPC B65D 65/40 (2013.01) [B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/18 (2013.01); B32B 27/283 (2013.01); B32B 27/32 (2013.01); C08L 23/26 (2013.01); C08L 53/00 (2013.01); B32B 2270/00 (2013.01); B32B 2307/7265 (2013.01); B32B 2307/73 (2013.01); B32B 2439/46 (2013.01); C08L 2205/035 (2013.01); C08L 2205/08 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A liquid-repellent layer forming resin composition comprising:
a polypropylene resin (A); and
at least one silylated polyolefin (B) selected from the group consisting of polyethylene-silicone block copolymers,
wherein the polypropylene resin (A) has two or more endothermic peaks in the range of 130 to 170° C. in a melting curve in a second heating process obtained under measurement conditions where the following steps (1) to (5) are carried out sequentially, in differential scanning calorimetry of a measurement specimen of a liquid-repellent layer formed by using the liquid-repellent layer forming resin composition:
(1) heating to 200° C. at a heating rate of 10° C./min, as a first heating process;
(2) retaining at 200° C. for 5 minutes;
(3) cooling to 0° C. at a cooling rate of 100° C./min;
(4) retaining at 0° C. for 5 minutes; and
(5) heating to 200° C. at a heating rate of 10° C./min, as the second heating process,
wherein the polypropylene resin (A) comprises a random polypropylene resin (A1) and a block polypropylene resin (A2) with a mass ratio (Mass of random polypropylene resin (A1)/Mass of block polypropylene resin (A2)) in the range of 35/65 to 65/35, and
wherein the block polypropylene resin (A2) has a melting point higher than that of the random polypropylene resin (A1) by 10° C. or more.