US 12,330,478 B2
Heating arrangement
Andreas Bernhardt, Munich (DE); and Frank Baur, Munich (DE)
Assigned to Vitesco Technologies GmbH, Hannover (DE)
Appl. No. 17/762,824
Filed by Vitesco Technologies GmbH, Regensburg (DE)
PCT Filed Sep. 23, 2020, PCT No. PCT/EP2020/076472
§ 371(c)(1), (2) Date Mar. 23, 2022,
PCT Pub. No. WO2021/058507, PCT Pub. Date Apr. 1, 2021.
Claims priority of application No. 10 2019 214 566.3 (DE), filed on Sep. 24, 2019.
Prior Publication US 2022/0339990 A1, Oct. 27, 2022
Int. Cl. B60H 1/22 (2006.01); H05B 3/06 (2006.01); H05B 3/46 (2006.01); H05K 1/14 (2006.01)
CPC B60H 1/2215 (2013.01) [H05B 3/06 (2013.01); H05B 3/46 (2013.01); H05K 1/147 (2013.01); H05B 2203/003 (2013.01); H05B 2203/013 (2013.01); H05B 2203/017 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A heating arrangement, comprising:
a coolant housing having an inflow connection and an outflow connection for a coolant;
heating elements arranged on at least two opposite housing walls of said coolant housing, said heating elements having power supply connections;
a circuit board with at least three circuit board pieces, said circuit-board pieces being disposed in a row and being connected to one another via flexible regions, said circuit board pieces including two edge circuit-board pieces carrying power electronic components and connections for connecting to said power-supply connections of said heating elements;
said circuit board being bent at said flexible regions to arrange said two edge circuit-board pieces to lie opposite one another; and
wherein said coolant housing is disposed between said edge circuit-board pieces, and wherein said power-supply connections of said heating elements and said connections on said edge circuit-board pieces are in electrical contact with one another.