US 12,330,430 B2
Thermal print head, thermal printer, and method of manufacturing heat sink
Kaoru Muraki, Kyoto (JP); and Kuniaki Nakamura, Kyoto (JP)
Assigned to ROHM CO., LTD., Kyoto (JP)
Filed by ROHM CO., LTD., Kyoto (JP)
Filed on Feb. 7, 2023, as Appl. No. 18/165,691.
Application 18/165,691 is a continuation of application No. PCT/JP2021/026870, filed on Jul. 16, 2021.
Claims priority of application No. 2020-141644 (JP), filed on Aug. 25, 2020.
Prior Publication US 2023/0182483 A1, Jun. 15, 2023
Int. Cl. B41J 2/375 (2006.01); B41J 2/335 (2006.01)
CPC B41J 2/375 (2013.01) [B41J 2/3358 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A thermal print head comprising:
a head substrate on which a plurality of heating resistance units are formed;
a heat sink thermally connected to the head substrate, a recess being formed in a back surface of the heat sink which faces a surface to which the head substrate is connected;
a metal member arranged in the recess; and
an adhesive arranged between a bottom surface of the recess and the metal member, wherein
the recess viewed from a direction perpendicular to the back surface includes:
an area where the metal member is arranged; and
a groove area where the metal member is not arranged,
a portion of the adhesive is arranged in the groove area, and
the groove area is surrounded by the metal member.