| CPC B41J 2/16552 (2013.01) [B41J 2/16523 (2013.01); B41J 2/16532 (2013.01); B41J 2/17596 (2013.01); B41J 2/18 (2013.01)] | 12 Claims |
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1. A substrate processing apparatus, comprising:
a head unit including a head having at least one nozzle for ejecting a treatment liquid to a substrate; and
a cleaning unit configured to clean the head,
wherein the cleaning unit includes
a stage configured to move in at least one horizontal direction;
a first cleaning member on the stage, the first cleaning member configured to spray a cleaning liquid to the head;
a second cleaning member on the stage the second cleaning member configured to form a suction space in combination with the head when being in close contact with the head, and remove impurities attached to the head by providing a reduced pressure to the suction space,
a liquid supply unit configured to supply the treatment liquid to the head unit; and
a controller configured to control the liquid supply unit, the head unit, and the cleaning unit,
wherein the second cleaning member includes
a suction part facing a lower portion of the head and having a plurality of suction holes formed therein; and
a sealing part disposed above the suction part to maintain airtightness of the suction space,
wherein the controller is configured to control the cleaning unit to remove the impurities attached to the head by providing the reduced pressure to the suction space,
wherein the reduced pressure is first provided to the suction space via a first suction hole of the plurality of suction boles close to the sealing part and is then provided to the suction space via a second suction hole of the plurality of suction holes, which is relatively farther from the sealing part compared to the first suction hole.
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