US 12,330,408 B2
Method for producing substrate for millimeter wave
Byoung Nam Kim, Suwon-si (KR); Hong Il Yoo, Gwangmyeong-si (KR); Jong Yup Lee, Incheon (KR); and Chul-Keun Park, Seongnam-si (KR)
Assigned to SENSORVIEW CO., LTD., Seongnam-si (KR)
Filed by SENSORVIEW CO., LTD., Seongnam-si (KR)
Filed on Mar. 16, 2023, as Appl. No. 18/184,831.
Claims priority of application No. 10-2022-0033202 (KR), filed on Mar. 17, 2022.
Prior Publication US 2023/0294389 A1, Sep. 21, 2023
Int. Cl. B32B 37/24 (2006.01); B32B 7/12 (2006.01); B32B 15/04 (2006.01); H01Q 1/38 (2006.01)
CPC B32B 37/24 (2013.01) [B32B 7/12 (2013.01); B32B 15/043 (2013.01); B32B 2037/243 (2013.01); B32B 2250/02 (2013.01); B32B 2255/06 (2013.01); B32B 2255/20 (2013.01); B32B 2255/26 (2013.01); B32B 2309/02 (2013.01); B32B 2311/00 (2013.01); B32B 2457/00 (2013.01); H01Q 1/38 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A method for producing a substrate for millimeter wave, the method comprising the steps of:
(a) mixing ceramic powder and polytetrafluoroethylene (PTFE) powder;
(b) dispersing the mixed ceramic powder and PTFE powder in a dispersion equipment;
(c) after the step of (b) dispersing is completed, outputting a paste of a mixture of the ceramic powder and the PTFE powder by additionally adding a solution and a binder to the dispersion equipment and then dispersing the mixture;
(d) applying the paste to a first metal thin film;
(e) drying the first metal thin film to which the paste is applied; and
(f) laminating a second metal thin film on the opposite side of the paste bonded to the dried first metal thin film and then thermally bonding it.