US 12,330,378 B2
Manufacturing method for optical unit and manufacturing method for optical module
Takeshi Fujikawa, Tokyo (JP); Makoto Yasuhara, Tokyo (JP); and Sadayuki Fukui, Tokyo (JP)
Assigned to Daicel Corporation, Osaka (JP)
Filed by Daicel Corporation, Osaka (JP)
Filed on Jun. 15, 2023, as Appl. No. 18/210,186.
Claims priority of application No. 2022-096875 (JP), filed on Jun. 15, 2022.
Prior Publication US 2023/0405940 A1, Dec. 21, 2023
Int. Cl. B29C 65/48 (2006.01); B29C 65/52 (2006.01); B29L 11/00 (2006.01)
CPC B29C 65/4845 (2013.01) [B29C 65/526 (2013.01); B29C 2793/0027 (2013.01); B29K 2995/0097 (2013.01); B29L 2011/0016 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A manufacturing method for an optical unit including
a first optical element configured to collimate or shape incident light from a light source, and
a second optical element configured to diffuse or shape irradiation light from the first optical element, the manufacturing method comprising:
molding a first wafer in which a plurality of the first optical elements are formed;
molding a second wafer in which a plurality of the second optical elements are formed;
forming a bonding portion with a predetermined adhesive in a first peripheral portion provided surrounding the first optical element in the first wafer or a second peripheral portion corresponding to the first peripheral portion, provided surrounding the second optical element in the second wafer;
bonding the first wafer and the second wafer with the bonding portion to seal the first optical element and/or the second optical element with the first wafer and the second wafer; and
cutting the first wafer and the second wafer at the first peripheral portion and the second peripheral portion in a state where the first wafer and the second wafer are bonded to each other to dice an optical unit including the first optical element and the second optical element, wherein
the adhesive in the bonding portion formed in the forming the bonding portion is in a semi-cured state.