US 12,330,262 B2
Dual membrane carrier head for chemical mechanical polishing
Steven M. Zuniga, Soquel, CA (US); Jay Gurusamy, Santa Clara, CA (US); and Andrew J. Nagengast, Sunnyvale, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Oct. 23, 2023, as Appl. No. 18/492,025.
Application 18/492,025 is a division of application No. 16/711,369, filed on Dec. 11, 2019, granted, now 11,945,073.
Claims priority of provisional application 62/890,570, filed on Aug. 22, 2019.
Prior Publication US 2024/0042574 A1, Feb. 8, 2024
Int. Cl. B24B 37/32 (2012.01); B24B 37/005 (2012.01); B24B 49/16 (2006.01)
CPC B24B 37/32 (2013.01) [B24B 37/005 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A method for chemical mechanical polishing with a carrier head, comprising: holding a substrate in the carrier head that includes a membrane assembly with an outer membrane and an inner membrane that defines a plurality of individually pressurizable annular inner chambers; pressurizing a lower chamber between the inner membrane and the outer membrane to a first pressure; pressurizing at least some of the plurality of individually pressurizable annular inner chambers to a second pressure equal to or greater than the first pressure, wherein each of the annular inner chambers of the plurality of individually pressurizable annular inner chambers is separated from an adjacent annular inner chamber by a gap therebetween, the gap open to the lower chamber such that cross-talk is reduced when pressurizing one individually pressurizable inner chamber that is adjacent another individually pressurizable annular inner chamber; and creating relative motion between the substrate and a polishing pad such that pressure from the lower chamber causes polishing of the substrate at a first rate and pressure of the one or more inner chambers supplementally increases the polishing of the substrate in regions corresponding to the individually pressurizable annular inner chambers.