| CPC B24B 37/205 (2013.01) [B24B 37/20 (2013.01); B24B 37/22 (2013.01); B24B 49/12 (2013.01)] | 10 Claims |

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1. A polishing pad for a chemical mechanical polishing apparatus, comprising:
a polishing article having an upper layer with a polishing surface, a lower portion, and an aperture formed through the polishing article, the aperture including a first section adjacent the polishing surface and through the upper layer and a second section adjacent the first section and through the lower portion, wherein the lower portion forms a projection extending inwardly into the aperture beyond an edge of the upper layer such that the second section is narrower than the first section, the projection having an upper surface substantially parallel to the polishing surface;
a window having a top surface substantially parallel to and coplanar with the polishing surface, a second portion aligned with the second section of the aperture and having a bottom surface with a recess that is narrower than the second section of the aperture, and a first portion extending outwardly from the second portion over the projection from the polishing article;
a first adhesive adhering an upper surface of the projection to a bottom of the first portion of the window; and
a second adhesive of different material composition than the first adhesive, the second adhesive positioned laterally between the second portion of the window and the projection.
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