US 12,330,243 B2
Method of forming an intermetallic phase layer with a plurality of nickel particles
Alexander Heinrich, Bad Abbach (DE); Alexander Roth, Zeitlarn (DE); and Catharina Wille, Regensburg (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Jun. 21, 2024, as Appl. No. 18/750,260.
Application 18/750,260 is a continuation of application No. 18/088,238, filed on Dec. 23, 2022, granted, now 12,023,762.
Application 18/088,238 is a continuation of application No. 17/118,008, filed on Dec. 10, 2020, granted, now 11,552,042, issued on Jan. 10, 2023.
Claims priority of application No. 102019134000.4 (DE), filed on Dec. 11, 2019; and application No. 102020130638.5 (DE), filed on Nov. 19, 2020.
Prior Publication US 2024/0335912 A1, Oct. 10, 2024
Int. Cl. B23K 35/02 (2006.01); B22F 1/052 (2022.01); B23K 35/30 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); B23K 101/40 (2006.01)
CPC B23K 35/0244 (2013.01) [B22F 1/052 (2022.01); B23K 35/0227 (2013.01); B23K 35/3033 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 23/49582 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); B22F 2301/15 (2013.01); B22F 2304/10 (2013.01); B23K 2101/40 (2018.08); H01L 2224/2746 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29118 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/29155 (2013.01); H01L 2224/29164 (2013.01); H01L 2224/29169 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A method of forming a layer structure, the method comprising:
arranging a layer of a solder material between a first layer comprising nickel or a nickel alloy and a third layer comprising nickel or a nickel alloy, wherein the solder material includes nickel and tin, wherein the nickel includes a first amount of particles and a second amount of particles, wherein a sum of the first amount of particles and the second amount of particles is a total amount of the nickel or less, wherein the first amount of particles is between 5 at % and 60 at % of the total amount of the nickel, wherein the second amount of particles is between 10 at % and 95 at % of the total amount of the nickel, wherein the particles of the first amount of particles have a size in a range from about 1 μm to about 20 μm, and wherein the particles of the second amount of particles have a size in a range from about 30 μm to about 50 μm; and
heating the layer to a melting temperature of the solder material until an intermetallic phase forms, to form a second layer between the first layer and the third layer.