US 12,330,232 B2
Method for monitoring a laser machining process on workpieces
Erich Schauer, Kuppenheim (DE); and Eric Supernok, Edesheim (DE)
Assigned to Precitec GmbH & Co. KG, Gaggenau (DE)
Appl. No. 17/769,368
Filed by Precitec Gmbh & Co. KG, Gaggenau (DE)
PCT Filed Oct. 6, 2020, PCT No. PCT/EP2020/077951
§ 371(c)(1), (2) Date Apr. 15, 2022,
PCT Pub. No. WO2021/073946, PCT Pub. Date Apr. 22, 2021.
Claims priority of application No. 10 2019 127 900 U (DE), filed on Oct. 16, 2019.
Prior Publication US 2024/0131619 A1, Apr. 25, 2024
Prior Publication US 2024/0227069 A9, Jul. 11, 2024
Int. Cl. B23K 26/03 (2006.01); B23K 31/12 (2006.01)
CPC B23K 26/034 (2013.01) [B23K 31/125 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A method for monitoring a laser machining process for machining workpieces, said method comprising:
for a plurality of machining steps of the same type, detecting a measurement signal for at least one measurement variable during a machining step;
in a setting phase, defining a limit value for at least one monitoring parameter based on the measurement signals detected during the setting phase; and
in a monitoring phase, determining a monitoring parameter value for the machining step carried out in the monitoring phase based on the measurement signal of said machining step, comparing the monitoring parameter value determined with the defined limit value to identify an faulty machining step, and determining whether a process change condition is met based on the measurement signal from at least one machining step,
wherein, after a predefined setting time interval or after a predefined number of machining steps carried out during the setting phase, the phase is switched from the setting phase to the monitoring phase, and the phase is switched back from the monitoring phase to the setting phase when the process change condition is met.