US 12,330,212 B2
Thin sheet-like connecting member and manufacturing method therefor, semiconductor device and manufacturing method therefor, and power conversion device
Issei Otani, Tokyo (JP); Hiroaki Tatsumi, Tokyo (JP); and Jumpei Sawada, Tokyo (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Appl. No. 17/759,295
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
PCT Filed Feb. 15, 2021, PCT No. PCT/JP2021/005430
§ 371(c)(1), (2) Date Jul. 22, 2022,
PCT Pub. No. WO2021/177006, PCT Pub. Date Sep. 10, 2021.
Claims priority of application No. 2020-038605 (JP), filed on Mar. 6, 2020.
Prior Publication US 2023/0055157 A1, Feb. 23, 2023
Int. Cl. B22F 1/18 (2022.01); B22F 1/00 (2022.01); B22F 7/08 (2006.01); H01B 1/22 (2006.01); H01L 21/52 (2006.01)
CPC B22F 1/18 (2022.01) [B22F 1/00 (2013.01); B22F 7/08 (2013.01); H01B 1/22 (2013.01); H01L 21/52 (2013.01); H01L 2224/32225 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for manufacturing a thin sheet-like bonding member, comprising:
applying a paste comprising first particles comprising a first metal, second particles comprising a second metal having a lower melting point than the first metal, and a solvent to a surface of a base material made of a substance that does not react with the second metal;
heating the paste at a temperature lower than a melting point of the first metal and higher than the melting point of the second metal to form a thin sheet-like bonding member on the surface of the base material; and
peeling the thin sheet-like bonding member from the base material to obtain the thin sheet-like bonding member.