US 12,330,157 B2
Optoelectronic tweezer device and fabrication method thereof
Shih-Hua Hsu, Hsinchu (TW); Wei-Han Chen, Hsinchu (TW); Ching-Wen Chen, Hsinchu (TW); and Ying-Hui Lai, Hsinchu (TW)
Assigned to Au Optronics Corporation, Hsinchu (TW)
Filed by Au Optronics Corporation, Hsinchu (TW)
Filed on May 23, 2022, as Appl. No. 17/750,399.
Claims priority of application No. 111103180 (TW), filed on Jan. 25, 2022.
Prior Publication US 2023/0234055 A1, Jul. 27, 2023
Int. Cl. B01L 3/00 (2006.01); B03C 5/02 (2006.01); G01N 15/1434 (2024.01)
CPC B01L 3/502761 (2013.01) [B01L 3/502707 (2013.01); B03C 5/026 (2013.01); G01N 15/1434 (2013.01); B01L 2200/0668 (2013.01); B01L 2300/12 (2013.01); B01L 2400/0454 (2013.01)] 10 Claims
OG exemplary drawing
 
1. An optical tweezer device, comprising:
a transparent substrate;
a semiconductor layer, located above the transparent substrate and comprising a first doping region, a second doping region and a transition region, wherein the transition region is located between the first doping region and the second doping region;
a first electrode, located on the first doping region and electrically connected to the first doping region; and
a dielectric layer, located above the semiconductor layer and having a first through hole overlapping the first electrode.