US 12,329,963 B2
Anatomically contoured stimulation leads for high density neural interface
Bo Lu, South San Francisco, CA (US); and Ken Rys, South San Francisco, CA (US)
Assigned to Verily Life Sciences LLC, Dallas, TX (US)
Appl. No. 17/774,397
Filed by Verily Life Sciences LLC, South San Francisco, CA (US)
PCT Filed Nov. 3, 2020, PCT No. PCT/US2020/058713
§ 371(c)(1), (2) Date May 4, 2022,
PCT Pub. No. WO2021/091901, PCT Pub. Date May 14, 2021.
Claims priority of provisional application 62/930,457, filed on Nov. 4, 2019.
Prior Publication US 2022/0387787 A1, Dec. 8, 2022
Int. Cl. A61N 1/05 (2006.01); A61N 1/375 (2006.01)
CPC A61N 1/0551 (2013.01) [A61N 1/3752 (2013.01); A61N 1/0534 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A thin-film lead assembly comprising:
a cable comprising: (i) a first supporting structure formed of one or more layers of dielectric material, (ii) a first set of conductive traces formed on a portion of the first supporting structure, (iii) a second supporting structure formed of one or more layers of dielectric material, and (iv) a second set of conductive traces formed on a portion of the second supporting structure;
an electrode assembly comprising: (i) a third supporting structure formed of one or more layers of dielectric material, (ii) a first set of electrodes in electrical connection with the first set of conductive traces, and (iii) a second set of electrodes in electrical connection with the second set of conductive traces; and
a connector comprising: (i) a fourth supporting structure formed on an end of the first supporting structure and an end of the second supporting structure, (ii) a first set of contacts or bond pads formed on at least a portion of the fourth supporting structure in electrical connection with the first set of conductive traces, and (iii) a second set of contacts or bond pads on at least another portion of the fourth supporting structure in electrical connection with the second set of conductive traces,
wherein the one or more layers of dielectric material of the first supporting structure, the second supporting structure, and the third supporting structure are monolithic, and the dielectric material is polyimide, liquid crystal polymer, parylene, polyether ether ketone, or a combination thereof.