US 12,329,645 B2
Methods of forming implants using heat bonding
Gregory C. Stalcup, Fort Wayne, IN (US); and Joseph W. Jurick, Fort Wayne, IN (US)
Assigned to SMed-TA/TD, LLC, Columbia City, IN (US)
Filed by SMed-TA/TD, LLC, Columbia City, IN (US)
Filed on Apr. 24, 2020, as Appl. No. 16/858,007.
Application 16/858,007 is a continuation of application No. 16/850,442, filed on Apr. 16, 2020.
Claims priority of provisional application 62/835,600, filed on Apr. 18, 2019.
Prior Publication US 2020/0330232 A1, Oct. 22, 2020
Int. Cl. A61F 2/30 (2006.01); A61F 2/28 (2006.01); B29C 65/00 (2006.01); B29C 65/02 (2006.01)
CPC A61F 2/3094 (2013.01) [A61F 2/28 (2013.01); A61F 2/30771 (2013.01); B29C 65/006 (2013.01); B29C 65/02 (2013.01); A61F 2002/30784 (2013.01); A61F 2002/3093 (2013.01); A61F 2002/30967 (2013.01); A61F 2002/30968 (2013.01); A61F 2310/00017 (2013.01); A61F 2310/00023 (2013.01); A61F 2310/00029 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A method of forming an orthopaedic implant, comprising:
placing a bonding portion of a mating part in an opening formed in an implant body, the opening defining a variable opening width, the implant body including a first wall that forms a bottom surface of the opening, the bottom surface of the opening of the implant body being positioned directly below a bottom surface of the bonding portion, the mating part including a post extending perpendicularly from the bonding portion, the implant body including a plurality of second walls defining the opening width and extending from the bottom surface of the opening of the implant body to a top surface of the implant body, the top surface of the implant body being perpendicular relative to a longitudinal axis of the post, a top surface of the bonding portion of the mating part being perpendicular relative to the longitudinal axis of the post; and
heat bonding the bonding portion to a material to bond the mating part to the implant body.