US 12,329,539 B2
Non-invasive skin sensor for long-term monitoring and method for fabricating the same
Jiyeon Han, Yongin-si (KR); Eunjoo Kim, Yongin-si (KR); Yeongin Kim, Cambridge, MA (US); Jeehwan Kim, Cambridge, MA (US); and Hanwool Yeun, Cambridge, MA (US)
Assigned to AMOREPACIFIC CORPORATION, Seoul (KR); and MASSACHUSETTS INSTITUTE OF TECHNOLOGY
Filed by AMOREPACIFIC CORPORATION, Seoul (KR); and MASSACHUSETTS INSTITUTE OF TECHNOLOGY, Cambridge, MA (US)
Filed on Feb. 11, 2022, as Appl. No. 17/669,920.
Claims priority of provisional application 63/185,513, filed on May 7, 2021.
Prior Publication US 2022/0354428 A1, Nov. 10, 2022
Int. Cl. A61B 5/00 (2006.01); A61B 5/01 (2006.01); A61B 5/0537 (2021.01)
CPC A61B 5/6833 (2013.01) [A61B 5/01 (2013.01); A61B 5/0537 (2013.01); A61B 5/443 (2013.01); A61B 2560/0242 (2013.01); A61B 2562/0261 (2013.01); A61B 2562/06 (2013.01); A61B 2562/164 (2013.01)] 17 Claims
OG exemplary drawing
 
1. An electronic module for monitoring a skin condition, comprising:
a first passivation layer configured to be positioned closer to a skin surface;
an electronic circuit unit built on the first passivation layer, and including a plurality of interconnects made of a conductive material and at least one sensing unit including a semiconductor property material, wherein each sensing unit includes at least one type of sensing unit selected from the group consisting of: one or more temperature sensing units, one or more hydration sensing units, one or more photo sensing units, and one or more strain sensing units; and
a second passivation layer formed on the electronic circuit unit,
wherein each of the first passivation layer, the electronic circuit unit and the second passivation layer includes a plurality of through-holes, wherein at least some of the plurality of through-holes in each layer form respective hole patterns, and
wherein the respective hole patterns in the first passivation layer, the electronic circuit unit and the second passivation layer have corresponding planar patterns that align to form a continuous open channel when the first passivation layer, the electronic circuit unit and the second passivation layer are stacked.