US D1,030,701 S
Headphone
Xi Wu, Dongguan (CN); Yujiao Yang, Dongguan (CN); Hong Zeng, Dongguan (CN); Hao Chen, Dongguan (CN); and Hao Ma, Dongguan (CN)
Assigned to Dongguan Liesheng Electronic Co., Ltd., Dongguan (CN)
Filed by Dongguan Liesheng Electronic Technology Co., Ltd., Dongguan (CN)
Filed on Jun. 26, 2023, as Appl. No. 35/517,797.
Claims priority of application No. 202330290305.0 (CN), filed on May 17, 2023.
Int. Filing Date Jun. 26, 2023
Int. Reg. No. DM/230053
Int. Reg. Date Jun. 26, 2023
Int. Reg. Pub. Date Jul. 14, 2023
Term of patent 15 Years
LOC (14) Cl. 14 - 01
U.S. Cl. D14—205
OG exemplary drawing
 
The ornamental design for a headphone, as shown and described.