US 12,010,895 B2
Organic light emitting diode display device and manufacturing method thereof
Lei Wang, Wuhan (CN)
Assigned to WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD., Wuhan (CN)
Appl. No. 17/264,262
Filed by WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD., Wuhan (CN)
PCT Filed Aug. 31, 2020, PCT No. PCT/CN2020/112509
§ 371(c)(1), (2) Date Mar. 10, 2023,
PCT Pub. No. WO2022/007151, PCT Pub. Date Jan. 13, 2022.
Claims priority of application No. 202010638515.X (CN), filed on Jul. 6, 2020.
Prior Publication US 2023/0200184 A1, Jun. 22, 2023
Int. Cl. G06V 40/13 (2022.01); H10K 59/12 (2023.01); H10K 59/122 (2023.01); H10K 59/38 (2023.01); H10K 59/65 (2023.01); H10K 59/80 (2023.01); H10K 77/10 (2023.01); H10K 102/00 (2023.01)
CPC H10K 59/65 (2023.02) [G06V 40/1318 (2022.01); H10K 59/1201 (2023.02); H10K 59/122 (2023.02); H10K 59/38 (2023.02); H10K 59/873 (2023.02); H10K 59/8792 (2023.02); H10K 77/111 (2023.02); H10K 2102/311 (2023.02)] 16 Claims
OG exemplary drawing
 
1. An organic light-emitting diode (OLED) display device, comprising:
a flexible substrate;
a thin film transistor (TFT) array layer disposed on the flexible substrate;
an OLED light-emitting functional layer disposed on the TFT array layer;
a color filter layer disposed on the OLED light-emitting functional layer;
a thin-film encapsulation layer disposed on the color filter layer, and the thin-film encapsulation layer comprising a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer stacked from bottom to top, wherein a first via-hole is formed in a surface of the second inorganic encapsulation layer, the first via-hole penetrates the second inorganic encapsulation layer and exposes the organic encapsulation layer, and the first via-hole is positioned above the fingerprint recognition sensor;
a fingerprint recognition sensor disposed on a side of the flexible substrate away from a finger contact side to receive reflected light reflected by a fingerprint, and identify the fingerprint according to the reflected light;
wherein a collimator lens structure is embedded in the first via-hole, the collimator lens structure is configured to allow the reflected light reflected by the fingerprint converged on different directions and allow the reflected light reflected in a vertical direction converged on the fingerprint recognition sensor; the collimator lens structure is a collimator lens, and the collimator lens comprises a main optical axis, and the main optical axis extends in a vertical direction.