	US 12,010,887 B2
	Semiconductor unit, method of manufacturing the same, and electronic apparatus
Hironobu Abe, Kanagawa (JP)
Assigned to SONY GROUP CORPORATION, Tokyo (JP)
Filed by Sony Group Corporation, Tokyo (JP)
Filed on Feb. 28, 2022, as Appl. No. 17/682,007.
Application 17/682,007 is a continuation of application No. 16/820,355, filed on Mar. 16, 2020, granted, now 11,302,766.
Application 16/820,355 is a continuation of application No. 16/108,492, filed on Aug. 22, 2018, granted, now 10,629,669, issued on Apr. 21, 2020.
Application 16/108,492 is a continuation of application No. 15/597,869, filed on May 17, 2017, granted, now 10,096,670, issued on Oct. 9, 2018.
Application 15/597,869 is a continuation of application No. 14/939,277, filed on Nov. 12, 2015, granted, now 9,698,209, issued on Jul. 4, 2017.
Application 14/939,277 is a continuation of application No. 13/753,268, filed on Jan. 29, 2013, granted, now 9,219,207, issued on Dec. 22, 2015.
Claims priority of application No. 2012-023315 (JP), filed on Feb. 6, 2012.
Prior Publication US 2022/0181430 A1, Jun. 9, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H10K 59/131 (2023.01); G02F 1/1345 (2006.01); H01L 23/48 (2006.01); H01L 27/12 (2006.01); H01L 33/62 (2010.01); H05K 1/02 (2006.01); H05K 3/36 (2006.01); H10K 77/10 (2023.01); H05K 3/32 (2006.01)

CPC H10K 59/131 (2023.02) [G02F 1/13452 (2013.01); H01L 23/48 (2013.01); H01L 33/62 (2013.01); H05K 1/0271 (2013.01); H05K 3/36 (2013.01); H05K 3/361 (2013.01); H10K 77/111 (2023.02); H01L 27/1218 (2013.01); H05K 3/323 (2013.01); H05K 2201/10136 (2013.01)]

20 Claims

1. A semiconductor unit, comprising:

a device substrate including a functional device and an electrode;

a first wiring substrate electrically connected to the functional device through the electrode; and

a second wiring substrate electrically connected to the functional device through the first wiring substrate, wherein the second wiring substrate is connected to a first drive circuit transmitting external signals.