US 12,010,820 B2
Liquid immersion cooling platform and components thereof
Jimil Shah, Plano, TX (US); and Jacob Mertel, Plano, TX (US)
Assigned to Modine LLC, Racine, WI (US)
Filed by MODINE LLC, Racine, WI (US)
Filed on Sep. 15, 2021, as Appl. No. 17/476,217.
Prior Publication US 2023/0080447 A1, Mar. 16, 2023
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20836 (2013.01) [H05K 7/20236 (2013.01); H05K 7/20272 (2013.01); H05K 7/20781 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A system comprising:
a vessel configured to hold thermally conductive, condensable dielectric fluid;
a pressure controller to reduce or increase an interior pressure of the vessel;
a computer component configured to be at least partially submerged within the dielectric fluid;
a fluid circulation system configured to draw the dielectric fluid from a sump area of the vessel, pass the dielectric fluid through a filter and deliver the dielectric fluid to a bath area of the vessel;
a pass through plate provided on the vessel and having a module and a conductor for transmitting signals from one side of the pass through plate to another side of the pass through plate, wherein the pass through plate and the module are hermetically sealed by an epoxy; and
a door provided on the vessel, the door openable to provide access to an interior of the vessel for removal of the computer component, wherein the door is independent of the pass through plate.