CPC H05K 7/20327 (2013.01) [F28D 15/0233 (2013.01); F28D 15/046 (2013.01); F28F 13/10 (2013.01); H05K 7/20309 (2013.01); F28F 2260/02 (2013.01)] | 11 Claims |
1. A cooling module for an electronic device, the cooling module comprising:
a body having formed therein a plurality of channels, each channel of the plurality of channels defined by a first channel surface positioned between opposing lateral channel surfaces to define a rectangular cross section normal to a channel axis;
a micro-structured boiling surface positioned adjacent the first channel surface of each channel;
a first piezoelectric transducer in acoustic communication with one of the opposing lateral channel surfaces of each channel and a second piezoelectric transducer in acoustic communication with the other opposing lateral channel surface, each transducer configured to direct acoustic waves on the micro-structured boiling surface;
an inlet header in fluid communication with each channel of the plurality of channels; and
an outlet header in fluid communication with each channel of the plurality of channels,
wherein the first and second piezoelectric transducers are transverse mode piezoelectric transducers having a resonant frequency (fp), and further including a controller configured to provide a range of acoustic modulating frequencies (fM) to the transducers resulting from signals of modulating strengths available at fp and fp±n·fM where “n≥1” is an integer.
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