CPC H05K 7/20181 (2013.01) [H05K 5/0256 (2013.01); H05K 5/03 (2013.01); H05K 7/20145 (2013.01); H05K 7/20154 (2013.01); F04D 29/703 (2013.01)] | 17 Claims |
1. A dust-proof telecommunication system comprising: a chassis; a central processing unit (CPU) or system on chip (SoC) located within the chassis, the CPU or SoC being cooled by an airflow; a cooling plate with a fin structure located within the chassis such that the CPU or SoC is positioned in an opening formed between two parallel portions of the cooling plate; and a filter module placed in the opening, the filter module having a filter cover that surrounds at least in part the CPU or SoC, the filter module further having a first air filter located at an inlet of the airflow, wherein a top surface of the filter cover is aligned with a top surface of the fin structure when the filter module is placed in the opening.
|