US 12,010,791 B2
Device, electronic apparatus, and wiring connection method
Hiroshi Kawai, Tokyo (JP); Taizo Nishimura, Tokyo (JP); Masahiko Shimizu, Tokyo (JP); Takayuki Tanaka, Tokyo (JP); and Naohiro Takahashi, Tokyo (JP)
Assigned to SONY GROUP CORPORATION, Tokyo (JP)
Appl. No. 17/754,625
Filed by SONY GROUP CORPORATION, Tokyo (JP)
PCT Filed Oct. 13, 2020, PCT No. PCT/JP2020/038638
§ 371(c)(1), (2) Date Apr. 7, 2022,
PCT Pub. No. WO2021/075427, PCT Pub. Date Apr. 22, 2021.
Claims priority of application No. 2019-188695 (JP), filed on Oct. 15, 2019.
Prior Publication US 2022/0394846 A1, Dec. 8, 2022
Int. Cl. H05K 1/02 (2006.01); H05K 3/20 (2006.01)
CPC H05K 1/0277 (2013.01) [H05K 3/20 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A device, comprising:
a base having elasticity;
a device body on the base;
a wiring line on the base;
a coupling member coupled to the wiring line; and
an electrically conductive adhesive layer between the wiring line and the coupling member, wherein
the wiring line extends from the electrically conductive adhesive layer to the device body,
the wiring line has a wiring portion that overlaps with the electrically conductive adhesive layer,
the electrically conductive adhesive layer includes:
a plurality of electrically conductive particles;
a first peripheral portion;
a first region that includes the plurality of electrically conductive particles in a crushed state; and
a second region closer to the first peripheral portion of the electrically conductive adhesive layer than the first region,
the second region includes the plurality of electrically conductive particles in an uncrushed state,
each of the first region and the second region of the electrically conductive adhesive layer is in contact with the wiring portion, and
the electrically conductive adhesive layer has a degree of polymerization that decreases from the first region to the second region in an extending direction of the wiring portion.