US 12,010,416 B1
Camera module including embedded ceramic substrate package
Wei Shi, San Jose, CA (US); and Adar Magen, Sunnyvale, CA (US)
Assigned to Apple Inc., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Sep. 17, 2020, as Appl. No. 17/024,024.
Claims priority of provisional application 62/907,253, filed on Sep. 27, 2019.
Int. Cl. H04N 23/57 (2023.01); H01L 27/146 (2006.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H04N 23/60 (2023.01)
CPC H04N 23/57 (2023.01) [H01L 27/14618 (2013.01); H01L 27/14627 (2013.01); H01L 27/14636 (2013.01); H01L 27/14683 (2013.01); H04N 23/54 (2023.01); H04N 23/60 (2023.01); H04N 23/55 (2023.01)] 20 Claims
OG exemplary drawing
 
1. A camera module, comprising:
an image sensor configured to capture light projected onto a surface of the image sensor; and
an embedded ceramic substrate package directly attached to the image sensor, the embedded ceramic substrate package comprising:
a bulk molding compound (BMC);
a ceramic substrate embedded in the BMC; and
one or more redistribution layers (RDLs) coupled to the BMC, at least one of the RDLs being on at least one surface of the BMC;
wherein at least one of the BMC or one of the RDLs is directly attached to the image sensor, and wherein at least one of the BMC or one of the RDLs includes electrical signal trace routing coupled to the image sensor.