CPC H03H 3/08 (2013.01) [H10N 30/40 (2023.02); H03H 2003/0435 (2013.01); H10N 30/50 (2023.02)] | 20 Claims |
1. A method of manufacturing an acoustic wave device, the method comprising:
bonding a support substrate to a first side of a z-propagation quartz layer with a first Euler angle φ in a range from 40° to 50°, a second Euler angle θ in a range from 85° to 95°, and a third Euler angle ψ in a range of 85° to 95°;
bonding a lithium based piezoelectric layer to a second side of the z-propagation quartz layer, the second side being opposite to the first side; and
forming an interdigital transducer electrode to a side of the lithium based piezoelectric layer that is opposite the z-propagation quartz layer.
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