US 12,009,612 B2
Dual-sided socket device with corrugation structures and shield structures
Srikant Nekkanty, Chandler, AZ (US); Steven Klein, Chandler, AZ (US); Feroz Mohammad, Chandler, AZ (US); Joe Walczyk, Tigard, OR (US); Kuang Liu, Queen Creek, AZ (US); and Zhichao Zhang, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Sep. 25, 2020, as Appl. No. 17/032,587.
Prior Publication US 2022/0102892 A1, Mar. 31, 2022
Int. Cl. H01R 13/11 (2006.01); H05K 1/02 (2006.01); H05K 9/00 (2006.01)
CPC H01R 13/11 (2013.01) [H05K 1/0213 (2013.01); H05K 9/0022 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A socket device comprising:
a socket body structure comprising a first side, and a second side opposite the first side;
conductors which each extend through the socket body structure and further extend vertically from each of the first side and the second side, wherein a pitch of the conductors at the first side is in a range of between 0.1 millimeters (mm) and 3 mm;
a first metallization structure which extends from the first side;
a second metallization structure which extends from the second side; and
a conductive shield structure, between the first side and the second side, which is electrically coupled to each of the first metallization structure and the second metallization structure, wherein the conductive shield structure substantially extends around one of the conductors;
wherein, for each of the first metallization structure and the second metallization structure, a vertical span of the metallization structure is in a range of between 0.05 mm and 2.0 mm, a portion of a side of the metallization structure forms a respective corrugation structure, and a horizontal span of the portion is at least 5% of the vertical span of the metallization structure.