US 12,009,589 B2
Terminal device
Yu Chan Yang, Shenzhen (CN); Chien-Ming Lee, Shenzhen (CN); Hanyang Wang, Reading (GB); Yi-Hsiang Liao, Shenzhen (CN); Lizhong Huang, Dongguan (CN); Guangxiang Zhu, Shanghai (CN); and Bin Yu, Shanghai (CN)
Assigned to HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Appl. No. 17/421,870
Filed by Huawei Technologies Co., Ltd., Shenzhen (CN)
PCT Filed Jan. 9, 2020, PCT No. PCT/CN2020/071207
§ 371(c)(1), (2) Date Jul. 9, 2021,
PCT Pub. No. WO2020/143719, PCT Pub. Date Jul. 16, 2020.
Claims priority of application No. 201910019373.6 (CN), filed on Jan. 9, 2019; and application No. 201910108932.0 (CN), filed on Feb. 3, 2019.
Prior Publication US 2022/0109234 A1, Apr. 7, 2022
Int. Cl. H01Q 1/24 (2006.01); H01Q 1/38 (2006.01); H01Q 1/40 (2006.01); H01Q 1/52 (2006.01)
CPC H01Q 1/40 (2013.01) [H01Q 1/243 (2013.01); H01Q 1/38 (2013.01); H01Q 1/52 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A terminal device, comprising:
a housing comprising an outer surface;
a metal line that is either disposed on the outer surface or is embedded in the housing, wherein the metal line is configured to receive or send an electromagnetic wave signal, wherein the metal line is a translucent metal line and comprises a metal mesh, wherein the metal mesh is coated with a metal layer, wherein the metal layer is configured to reduce impedance of the metal mesh, wherein a transmittance of the metal line is Y, and wherein a value range of Y is 50%≤Y≤95%;
a circuit board configured to hold electronic parts and components; and
a signal line disposed on the circuit board and forming a gap between the signal line and the metal line,
wherein the signal line and the metal line are configured to feed the electromagnetic wave signal through the gap in a coupling manner.