US 12,009,587 B2
Antenna module
Hee Su Kim, Gyeonggi-do (KR); Gwan Woo Son, Gyeonggi-do (KR); and Won Ro Lee, Gyeonggi-do (KR)
Assigned to KESPION CO., LTD., Incheon (KR)
Filed by KESPION Co., Ltd., Incheon (KR)
Filed on Jan. 27, 2022, as Appl. No. 17/585,821.
Application 17/585,821 is a continuation in part of application No. PCT/KR2021/002173, filed on Feb. 22, 2021.
Claims priority of application No. 10-2020-0024872 (KR), filed on Feb. 28, 2020.
Prior Publication US 2022/0173505 A1, Jun. 2, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01Q 1/38 (2006.01); H01Q 1/36 (2006.01); H01Q 1/52 (2006.01)
CPC H01Q 1/38 (2013.01) [H01Q 1/364 (2013.01); H01Q 1/526 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An antenna module comprising:
a first antenna formed on one surface of an injection-molded product;
a contact circuit formed on the other surface of the injection-molded product and electrically connected to the first antenna; and
a shielding layer formed on the other surface of the injection-molded product at a position corresponding to the first antenna and configured to at least partially overlap the first antenna formed on one surface of the injection-molded product to shield electromagnetic waves,
wherein the injection-molded product has a thickness greater than a sum of a thickness of the first antenna and a thickness of the shielding layer, so that the shielding layer is spaced apart from the first antenna by the thickness of the injection-molded product.