US 12,009,573 B2
Electronic device including antenna
Seong Beom Hong, Seoul (KR); Hyung Wook Kim, Gyeonggi-do (KR); and Sung Chul Park, Seoul (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed on Sep. 16, 2022, as Appl. No. 17/946,130.
Application 17/946,130 is a continuation of application No. 17/239,814, filed on Apr. 26, 2021, granted, now 11,450,944.
Application 17/239,814 is a continuation of application No. 16/177,535, filed on Nov. 1, 2018, granted, now 10,992,023, issued on Apr. 27, 2021.
Claims priority of application No. 10-2017-0144972 (KR), filed on Nov. 1, 2017.
Prior Publication US 2023/0083309 A1, Mar. 16, 2023
Int. Cl. H01Q 1/22 (2006.01); H01Q 1/24 (2006.01); H01Q 1/52 (2006.01); H01Q 3/26 (2006.01); H01Q 3/40 (2006.01); H01Q 5/42 (2015.01); H01Q 5/48 (2015.01); H01Q 11/14 (2006.01); H01Q 21/06 (2006.01); H01Q 21/24 (2006.01); H01Q 21/28 (2006.01)
CPC H01Q 1/2283 (2013.01) [H01Q 1/243 (2013.01); H01Q 1/52 (2013.01); H01Q 3/2635 (2013.01); H01Q 3/40 (2013.01); H01Q 5/42 (2015.01); H01Q 5/48 (2015.01); H01Q 11/14 (2013.01); H01Q 21/062 (2013.01); H01Q 21/245 (2013.01); H01Q 21/28 (2013.01)] 28 Claims
OG exemplary drawing
 
1. A portable communication device, comprising:
a housing including a conductive member and a glass layer, the glass layer forming a portion of an outer surface of the portable communication device, the housing including at least one opening formed in a portion of the conductive member;
a first antenna array accommodated in the housing and facing in a first direction, the first antenna array including at least one antenna element facing the at least one opening; and
a second antenna array accommodated in the housing and facing in a second direction,
wherein the at least one opening is located between the glass layer and the first antenna array,
wherein a non-conductive member is disposed on the at least one antenna element and between the glass layer and the first antenna array, and
wherein an opaque layer is located at least between the non-conductive member and the glass layer.